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SolidBond / goot Solder Suction Wire CP-3015

SolidBond / goot Solder Suction Wire CP-3015

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This solder wick is made of copper wire coated with a special flux. It instantly sucks up molten solder and removes excess solder when heated. It's ideal for removing old solder from circuit boards, pots, jacks, and pickup replacements, as well as from delicate areas such as surface-mounted devices (SMDs) and around multi-pin ICs, which are difficult to remove with a solder wick. Its wire width is 3.0 mm and its length is 1.5 m.
[RMA-compliant flux included as standard]
- A special non-chlorine flux is impregnated into the copper braided wire for efficient solder removal. Ideal for precision electronics, SMD component removal, and solder short repair.

[Lead-free solder wick]
- For lead-free solder removal. The thin and soft wick conforms to the circuit board and transfers heat efficiently.
- High thermal response allows for faster solder removal compared to conventional products, making it recommended for lead-free solder, which is subject to high thermal loads.

■Solder wick
■Width: Approx. 3.0 mm
■Length: Approx. 1.5 mm
■Non-chlorine (RMA) compliant flux
■Lead-free solder compatible
■Comes in an ESD-safe case
■Static-protection specifications

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SolidBond
goot Solder Suction Wire CP-3015

Item ID:370269

280 yen(incl. tax)

  • Free shipping on orders over 3,000 yen

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